The novel large substrate SCHMID CMP (Chemical mechanical polishing) line has emerged out of the semiconductor world into printed PCB manufacturing as a critical step for next generation multi-layer boards and substrates. For achieving global surface polishing of plated copper with outstanding uniformity, an always well-defined form factor of the dielectric as well as copper lines, planes and vias is achieved.

The Oscar type of polishing setup achieves fastest planarization with minimal dishing for all kinds of
copper-crystal structures. Along with the Schmid process know how CMP delivers an optimal tribochemical process resulting in a perfect synergy between friction and corrosion. Especially higher density build up with decreasing feature sizes require accurate layer definition.

In particular, in new processes like embedded traces, HAR via filling or mSAP/SAP, CMP is a key to high yield and access to new low DK epoxy materials.

The CMP as a part of the SCHMID embedded trace technology supports all requirements for industry 4.0. Different interfaces to customers MES are available. The web-based HMI allows to run and control the system from different devices.