Coating Thickness Measurement and Quality Control 

The panel measuring table offers a quick determination of the etching distribution after differential etching processes or the plating build-up of copper surfaces. The measurements are carried out fully automatically by a resistive sensor after entering the input parameters.

Subsequently, the measuring points are evaluated by a PC and converted into a 3D diagram, statistics tool included.

• Precise and repeatable: fully automated measurement avoids manual handling and operation error
• Fast: 100 measuring points in 3.5 min
• Flexible: accommodates variable panel formats
• Quality control of etching and plating processes
• Process drifts are easy to spot and to correct
• Reduction of yield loss by early detection

• Dimensions: 1200 x 1120 x 1210 mm (L x W x H)
• Weight: 200 kg
• Maximum panel size: 650 x 650 mm
• Measuring range:
  copper thicknesses 1 µm – 120 µm
• Measuring tolerances:
  0.1 µm – 10 µm
  Cu layer 0.1 µm – 5 µm: ± 0.075 µm
  Cu layer 5 µm – 10 µm: ± < 1,5 %
  5 µm – 120 µm
  Cu layer 5 µm – 50 µm: ± 0.5 µm
  Cu layer 50 µm – 80 µm: ± < 1 %
  Cu layer 80 µm – 120 µm: ± < 2 %

Parameter Input:

• Panel dimensions in X and Y direction
• Measuring point distance from panel edge
• Number of measuring points in X and Y direction
• Expected measuring value
• Measuring tolerance
• Repeated measurements if measuring value is out of tolerance
• Individual selection of measuring points

Data Output

• Maximum and minimum value
• Average value
• Standard deviation
• 3D and line diagrams with measuring report
• CP and CPK analysis
• All values stored in a SQL server (database)