Oxide replacement processes, such as Circubond, Multibond, Alpha-Prep, MEC-Etch-Bond etc., promote adhesion of copper and resin during the multilayer lamination process and eliminate the “pink ring” phenomenon. The standard process comprises cleaning, degreasing, conditioning and micro-structuring of the copper surface.

• Fully automatic dosing controlled by area or density calculation
• Batch dosing system for process chemicals
• Multiple cascade rinsing with flood nozzles to remove chemical residues
• Safe transport of very thin inner layer down to 0.025 mm material thickness