Immersion Tin is the lead-free alternative to the Hot Air Levelling process. An extremely finely textured tin layer with a thickness between 0.7 μm and 1 μm is applied to the circuit board surface and into the bore holes. The tin layer protects untreated copper from oxidation; it is a perfect foundation for soldering applications, as well as for plug contacts.

• Highly homogenous surface structure ensures a constant solderability of the circuit board
• Reduction of chemical deposits and cleaning costs by minimizing oxygen enrichment
• Heat exchanger (optional) for energy recovery from rinse water
• Reduction of surface turbulence and foam formation owing to immersion bath with integrated leveling tank