An OSP (Organic Surface Preservative) anti-oxidation layer with a thickness of 0.2 µm – 0.5 µm is applied to the surface of the bare copper. This layer enhances the soldering characteristics on the copper pad and in the drilled holes. The OSP pre-treated end surface guarantees a perfect basis for various, lead-free soldering processes while maintaining the thermal stability.

• Spray bar, flood bar and flood unit with immersion tray
• Pressure adjustment for top and bottom separately adjustable
• Reduced drag in/out because of squeegee module
• Reduces bath turbulences and foam formation
• Fully automatic dosing controlled by panel counter and area calculator
• Fully automatic cleaning and make-up programs (optional)