Solder Reflow and Packaging Furnace
Specialized solder-related applications
The 3500 Series Reflow and Packaging Furnace from SCHMID is designed for precision processing in manufacturing operations requiring performance of the highest quality and consistency. These ovens are rated at 600 °C for maximum process flexibility, more than twice as high as the average solder reflow oven. Technologically advanced heating elements and control systems work together to create exceptionally stable temperature uniformity and repeatability throughout the process chamber. Graduated cooling sections can be custom designed to accommodate the most dynamic thermal processes.
SCHMID’s innovative and product specific atmosphere distribution and management systems optimize the process results. A controlled atmosphere capability of 1-3 ppm above source gas purity is guaranteed. Through extraction of burn-off effluents across the entire chamber width keeps part yields high. SCHMID muffles are designed for maximum rigidity and durability under extreme operating conditions insuring years of trouble free manufacturing.
The Furnace Monitoring System (FMS) is the culmination of decades of thermal processing expertise, and incorporates the latest technology in digital controls and monitoring systems. The result is a powerful yet intuitive interface with comprehensive data logging, process control, and process characterization features.
- Lead and lead-free solder reflow
- BGA reflow
- Wafer bumping
- Package sealing