In the area of module production substrate surfaces are cleaned in different qualities depending on the requirements of the downstream processes. With different line configurations particles down to a minimum diameter of 1 µm can be removed from the surface.

• Gentle and efficient cleaning of glass surfaces by precisely adjustable and checkable process parameters
• Optimum preparation of surfaces for downstream processes by a modularly configurable line design
• Processing glass substrates and films with a high process reliability and machine availability