The robot transfers wafers (or cells) from the incoming belt to a various number of tracks between one and five on the outgoing belt – and vice versa.
In addition the wafers can be sorted into trays or can be taken out of trays. Individual belts convey the wafers in and out of the machine, so no conversion is needed for different wafer sizes and a gentle transport is guaranteed.
An integrated camera system detects the position, defects and overlapping wafers. Misaligned wafers will be placed into the correct position and damaged and overlapping wafers will be removed.
A special Bernoulli-gripper has been developed to enable gentle and contact-free gripping.