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Vertical processing with clamping frames

Our new product series InfinityLine V+ provides the answer to the questions of future-oriented technologies such as SAP and mSAP in serial production for the Advanced HDI and IC PCB markets.

It is characterized by a vertical contact-less transport with innovative clamping frames. Their design allows you to transport the thinnest substrates safely. The newly designed drive system below the production level enables clean room capabilities in circuit board production unrivaled to this day.

The basis for this is the unique modular concept continually developed by SCHMID over decades. The InfinityLine V+ guarantees maximum flexibility and security of investment for all innovative processes.

Already today the InfinityLine V + supports all requirements of the industry 4.0 by providing interfaces to the customer’s individual production control system (MES). It meets all industrial standards worldwide. Furthermore it has an option for mature 6GEM interfaces.
The web-enabled server interface offers the possibility to monitor and control the system by means of various mobile terminals.

  • Maximized yield through contact-less frame transport
  • Most homogeneous process results by vertical transport: no “puddling”
  • Clean room compatible (depending on equipment variant)
  • Individually configurable due to modular design
  • Minimized footprint
  • Ready for industry 4.0

Panel sizes/dimensions:

  • 0.025 mm – 2.4 mm
  • Minimum: 18” x 18” (457 x 457 mm)
  • Maximum: 24” x 24” (610 x 610 mm)
  • Use of transport clamping frames

Transport speed:

  • 4 panels per minute
  • Transport speed: 0.2 – 6 m/min


  • Possibility for integration into an intralogistics system (SCHMID single panel / frame automation)
  • Loader and unloader for most different concepts available separately
  • User-oriented interfaces configurable



  • Developing (Litho & SR)
  • Flash-Etching
  • Stripping (i.a. amines)
  • Pre-Treatment
  • Ti-Etching