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Coating Thickness Measurement and Quality Control 

The panel measuring table offers a quick determination of the etching distribution after differential etching processes or the plating build-up of copper surfaces. The measurements are carried out fully automatically by a resistive sensor after entering the input parameters.

Subsequently, the measuring points are evaluated by a PC and converted into a 3D diagram, statistics tool included.

  • Precise and repeatable: fully automated measurement avoids manual handling and operation error
  • Fast: 100 measuring points in 3.5 min
  • Flexible: accommodates variable panel formats
  • Quality control of etching and plating processes
  • Process drifts are easy to spot and to correct
  • Reduction of yield loss by early detection
  • Dimensions: 1200 x 1120 x 1210 mm (L x W x H)
  • Weight: 200 kg
  • Maximum panel size: 650 x 650 mm
  • Measuring range:
    copper thicknesses 1 µm – 120 µm
  • Measuring tolerances:
    0.1 µm – 10 µm
    Cu layer 0.1 µm – 5 µm: ± 0.075 µm
    Cu layer 5 µm – 10 µm: ± < 1,5 %
    5 µm – 120 µm
    Cu layer 5 µm – 50 µm: ± 0.5 µm
    Cu layer 50 µm – 80 µm: ± < 1 %
    Cu layer 80 µm – 120 µm: ± < 2 %

Parameter Input:

  • Panel dimensions in X and Y direction
  • Measuring point distance from panel edge
  • Number of measuring points in X and Y direction
  • Expected measuring value
  • Measuring tolerance
  • Repeated measurements if measuring value is out of tolerance
  • Individual selection of measuring points

Data Output

  • Maximum and minimum value
  • Average value
  • Standard deviation
  • 3D and line diagrams with measuring report
  • CP and CPK analysis
  • All values stored in a SQL server (database)