Oxide replacement processes, such as Circubond, Multibond, Alpha-Prep, MEC-Etch-Bond etc., promote adhesion of copper and resin during the multilayer lamination process and eliminate the “pink ring” phenomenon. The standard process comprises cleaning, degreasing, conditioning and micro-structuring of the copper surface.
Blackoxide and Bond Processes
Inline system for copper surface conditioning of multi-layer innerlayers.
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Highlights 2020
