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Oxide replacement processes, such as Circubond, Multibond, Alpha-Prep, MEC-Etch-Bond etc., promote adhesion of copper and resin during the multilayer lamination process and eliminate the “pink ring” phenomenon.   The standard process comprises cleaning, degreasing, conditioning and micro-structuring of the copper surface.

  • Fully automatic dosing controlled by area or density calculation
  • Batch dosing system for process chemicals
  • Multiple cascade rinsing with flood nozzles to remove chemical residues
  • Safe transport of very thin inner layer down to 0.025 mm material thickness