Blackoxide and Bond Processes

Inline system for copper surface conditioning of multi-layer innerlayers.

Blackoxide and Bond Processes

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Details
Benefits

Oxide replacement processes, such as Circubond, Multibond, Alpha-Prep, MEC-Etch-Bond etc., promote adhesion of copper and resin during the multilayer lamination process and eliminate the “pink ring” phenomenon. The standard process comprises cleaning, degreasing, conditioning and micro-structuring of the copper surface.

Fully automatic dosing controlled by area or density calculation
Batch dosing system for process chemicals
Multiple cascade rinsing with flood nozzles to remove chemical residues
Safe transport of very thin inner layer down to 0.025 mm material thickness

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Highlights 2020

InfinityLine V+

New Etching Options