The fully automated microetching process roughens the copper surface, thus improving the adhesion. The microetching machine is used either before laminating the photoresist or prior to the compression of the inner layers.
Inline system for copper surface conditioning of multi-layer innerlayers.
Inline system for OSP coating processes as a protection against oxidation.
Inline system for the tin-plating of copper surfaces and bore holes after solder mask coating.
The micro etching machine is used to remove oxide film from the copper surfaces of PCBs and roughen the surfaces.
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