InfinityLine L+ made by SCHMID

Chemical Mechanical Polishing by InfinityLine L+

Chemical Mechanical Planarization for rectangular substrates and PCBs up to
24.5” x 24.5”, delivering excellent flatness and uniformity. Suitable for advanced build-up technologies for panel level packaging and SLP including SCHMID “Any Layer ET-Board”, SAP and TGV level as Glasssubrates.

The technology will be a must for sub 5 μm structures in high volume manufacturing.
Depending on the application, a wide range of slurry chemistries can be employed to match specific product need.

Product Benefits

Solution for high-end HDI+ and IC substrates with structures down to 2μm

Best in class process which combines material flexibility with leveling uniformity

Field proven solution suited for large substrate sizes up to 24.5” x 24.5”

Offers a new universe for PCB design in combination with the SCHMID embedded trace technology

Details

The OSCAR CMP system achieves fastest planarization with minimal dishing across all copper-crystal structures. Combined with SCHMID’s process know-how, it ensures optimal polishing performance with perfect synergy between uniformity and removal rate.

In advanced applications such as embedded traces, HAR via filling, or mSAP/SAP, CMP is the key to high yield and enables the use of new low-Dk epoxy materials.

As part of SCHMID’s embedded trace technology, the CMP system fully supports Industry 4.0 requirements. It offers multiple interfaces to customer MES systems, and the web-based HMI enables operation and control from any device.

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