Our inductively coupled plasma modules enable efficient desmear and surface treatment of low loss high frequency substrate materials, as well as deposition of dielectric layers.
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PlasmaLine
Other equipment for electronics
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ET Board
ET process by SCHMID is a new process which is capable to process line & space down to 2µm with an embedded trace technology based on the next generation of productions tools.
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Vertical and Horizontal Wet Process
With our different lines InfinityLine H+ and V+, we offer horizontal and vertical wet processing to fulfill all demands of future-oriented technologies such as SAP and mSAP in serial production for the Advanced HDI and IC substrate markets.
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Plating
Find out about our modular vertical touch free plating clusters. For different plating applications, adjustable shieldings, diaphragma, vertical or laminar parallel electrolyte flow are available.
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Chemical Mechanical Polishing
The novel SCHMID CMP (Chemical Mechanical Polishing) line for large substrates stands as a solution for the decisive step for the next generation of multilayer PCBs and substrates. The SCHMID CMP offers a new universe for PCB designs in combination with the SCHMID embedded trace technology.
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Automation
In addition to the wet processes, we are specialized in automation systems for the electronics market. We automate individual machines, to be integrated into innovative Smart Factories.
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Contact
We look forward to getting to know you!
Simply select your region and leave us a message.
EUROPE
CHINA
Tracy Xie
xie.tr@schmid-group.com
TAIWAN
Johnny Tseng
tseng.jo@schmid-group.com
KOREA
Jaho Kim
kim.jh@schmid-group.com
REST OF ASIA
AMERICA